English
Language : 

IC-553-1-MF Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Dual InlineMemoryModule (DIMM, 160 pins)
IC553 Series
Dual Inline Memory Module (DIMM, 160 pins)
Specifications
Insulation Resistance:
1,000MW min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mW max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles:
10,000 insertions min.
Pin Count:
160 contact pins
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í Card thickness 1.57mm
Part Number (Details)
IC-553 - 1 - MF
Series No.
Design No.
MF = Flanged
Unmarked = Not Flanged
Outline Socket Dimensions
Æ3.20 Thru hole
102.87 ±0.2
1.27x37=46.99 ±0.2 1.27x41=52.07 ±0.2
3.81 Ref
2.54
Recommended PC Board Layout
Top View from Socket
141.00 ±0.1
102.87 ±0.1
1.27x37=46.99 ±0.1
1.27x41=52.07 ±0.1
1.27±0.05
(3.81)
160-Æ0.80
+
0.1
0
1.27 ±0.1
108.00
+ 0.2
0
132.00 ±0.4
141.00 ±0.2
150.00 ±0.4
1.27 ±0.1
110.50
+
0.2
0
1.50
+0
0.1
R 0.75
Æ3.20
+ 0.1
0
1.27 ±0.05
Matching Module Dimensions
1.88 ±0.05
3.70 ±0.5
w0.40 x t0.30
46.99
102.87
104.65 Ref
110.24
+ 0.26
– 0.25
52.07
1.57
±0.15
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In B-3