YDA142 Datasheet, PDF (10/18 Pages) YAMAHA CORPORATION – D- 3D DIGITAL INPUT STEREO 9.5W DIGITAL AUDIO POWER AMPLIFIER

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çççYDA142
DC Input Detection Function
This is a function to make the DC Input Protection Mode (disables digital amplifier output stage) when a digital input signal
of the DC input detection voltage level (V_DCIN) or more continues over the DC input detection time (T_DCIN) without change
of polarity.
DC Input Protection Mode is cancelled when “L” is set to SLEEPN terminal or a digital input signal becomes lower than
V_DCIN or its polarity is changed.
●5V Regulator Function
YDA142 outputs 5V (V_REG) to REFA terminal when SLEEPN terminal is “H”. Connect a capacitor of 0.1µF or over to
REFA terminal for stabilization.
Connect the REFA terminal to DVDD terminal on a board.
And, don’t connect the REFA terminal to other terminals except DVDD terminal and YDA142 input terminals.
●Pop-noise Reduction Function
Pop-noise Reduction Function works when powered on, when shut down, when SLEEP ON/OFF is switched, or when
Mute ON/OFF is switched.
●Power dissipation
The power dissipation of YDA142 is limited by ｊunction temperature rating (125℃) and package thermal resistance
(15.4℃/W: 4-layer board).
The power dissipation and junction temperature can be found by the following formula.
When used, take care so that the power dissipation and junction temperature do not exceed the absolute maximum ratings.
・Formula for the power dissipation
Ploss = (Pout × Rpn / Rl) × 2 + Idc × Vdc
Ploss
Pout
Rpn
Rl
Idc
Vdc
: Power Dissipation (W)
: Output Power (W)
: 0.66 (constant)
: Load Resistance (Ω)
: 0.035(constant/at V_DDP=12V)
0.028(constant/at V_DDP=9V)
0.038(constant/at V_DDP=13.5V)
: Supply Voltage (V)
・Formula for the junction temperature
Tj = Ploss × θja + Ta
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
0
10 20 30 40 50 60 70 80 90
Ploss
θja
Ta
: Power Dissipation (W)
: 15.4(constant/package thermal resistance (℃/W), 4-layer board)
: Ambient temperature (℃)
●Package thermal resistance
The package (52SSOP) for YDA142 has a Thermal Pad for radiation on the surface. Use this Thermal Pad by soldering on
a board.
The package’s thermal resistance is 15.4℃/W (4-layer board). This thermal resistance is a value measured under the
following conditions: board size 136mm×85mm, 1st layer and 4th layer copper foil board density 154%, 2nd layer and 3rd
layer copper foil board density 200%, no wind. In addition, the lower side pattern of the Thermal Pad is connected to all the
layers in a board by through holes (φ0.4).
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