SR0402DR-071RL Datasheet, PDF (7/9 Pages) YAGEO Corporation – SURGE CHIP RESISTORS

Chip Resistor Surface Mount
Product specification 7
SR SERIES 0402/0603/0805/1206/1210/1218/2010/2512
9
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Temperature
Coefficient of
Resistance (T.C.R.)
TEST METHOD
PROCEDURE
MIL-STD-202 Method 304 At +25/–55 °C and +25/+125 °C
Formula:
T.C.R=
R₂–R₁
-------------------------
×
10⁶
(ppm/°C)
R₁(t₂–t₁)
Where
t₁= +25 °C or specified room temperature
t₂= –55 °C or +125 °C test temperature
R₁=resistance at reference temperature in ohms
R₂=resistance at test temperature in ohms
REQUIREMENTS
Refer to table 2
Short Time Overload _{IEC60115-1 4.13}
High Temperature
Exposure
IEC 60068-2-2
2.5 times of rated voltage or maximum overload
voltage whichever is less for 5 sec
at room temperature
± (2.0%+0.05 Ω)
1,000 hours at TA = 155 °C ± 5 °C, unpowered
± (2.0%+0.05 Ω)
Humidity
IEC 60115-1 4.24.2
Steady state for 1,000 hours at 40 °C / 95% R.H.
RCWV applied for 1.5 hours on and 0.5 hour off
± (3.0%+0.05 Ω)
Life
Resistance to
Soldering Heat
IEC 60115-1 4.25.1
1,000 hours at 70± 2 °C, RCWV applied for 1.5
MIL-STD-202 Method 108 ^{hours on, 0.5 hour off, still-air required}
± (2.0%+0.05 Ω)
IEC 60115-1 4.18
MIL-STD- 202 Method 210
Condition B, no pre-heat of samples
Lead-free solder, 260± 5 °C, 10± 1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (1.0%+0.05 Ω)
No visible damage
Temperature Cycling _JESD22-A104C
-55/+125 °C for 1 cycle per hour, with 1,000 cycles. ± (1.0%+0.05 Ω)
Devices mounted
Nov. 11, 2016 V.1
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