ANT1003LL15R2455A Datasheet, PDF (4/7 Pages) YAGEO Corporation – WIRELESS COMPONENTS

WIRELESS COMPONENTS
Ceramic Chip Antenna
REFERENCE DESIGN OF EVALUATION BOARD
Product specification 4
7
Fig. 2 Outlook and dimension of evaluation board
Tol : ±0.1
Unit : mm
Soldering Pads of Chip Antenna
Footprint for Feeding
Fig. 3 Details of soldering pad
Oct. 29, 2012 V0
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