PK562 Datasheet, PDF (2/3 Pages) Xilinx, Inc – Average Weight: 10.2338g

100% Material Declaration Data Sheet – 7 Series FF901
Component
Underfill
Lid
Lid Adhesive
Solder Ball
Substrate
Substance
Description
Bisphenol F/
epichlorohydrin
copolymer
Phenolic Resin
Bisphenol A type
liquid epoxy resin
Amine type
accelerator
Silicon Dioxide
Carbon Black
Additives
Copper (Cu)
Nickel (Ni)
Aluminum Oxide
AI203
Dimethyl siloxane,
dimethylvinyl-
terminated
Tin (Sn)
Lead (Pb)
Copper (Cu)
Tin (Sn)
Lead (Pb)
Silver (Ag)
BT Core
ABF
Solder Mask
CAS Number
or
Description
Percentage
of
Component
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
7440-50-8
7440-02-0
1344-28-1
68083-19-2
20.00
15.00
5.00
5.00
51.50
1.00
2.50
99.12
0.88
70.00
30.00
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
63.00
37.00
41.02
0.83
0.17
0.02
44.06
11.60
2.29
Use in Product
Basis
Basis
Basis
Basis
Basis
Basis
Additive
Main Material
Main Material
Basis
Basis
Main Material
Main Material
Component Weight/
Substance Weight
(grams)
0.053000
Component
Percent of Total
0.518
0.010600
0.007950
0.002650
0.002650
0.027295
0.000530
0.001325
5.818000
5.766802
0.051198
0.103000
0.072100
0.030900
0.856618
0.539669
0.316949
2.806923
1.151484
0.023354
0.004856
0.000477
1.236702
0.325659
0.064391
56.851
1.006
8.370
27.428
PK562 (v1.1) October 12, 2012
www.xilinx.com
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