PK558 Datasheet, PDF (2/3 Pages) Xilinx, Inc – Average Weight: 24.9750g

100% Material Declaration Data Sheet – 7 Series FFG1927
Component
Capacitor 4
Underfill
Lid
Lid Adhesive
Solder Ball
Substrate
Substance
Description
CAS
Number or
Description
Percentage
of
Component
BaTiO3 type
Nickel (Ni)
Copper (Cu)
Glass
Nickel (Ni)
Tin (Sn)
12047-27-7
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-31-5
Bisphenol F/
epichlorohydrin
copolymer
Phenolic Resin
Bisphenol A type liquid
epoxy resin
Amine type accelerator
Silicon Dioxide
Carbon Black
Additives
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
Copper (Cu)
Nickel (Ni)
7440-50-8
7440-02-0
Aluminium Oxide Al2O3
Dimethyl siloxane,
dimethylvinyl-
terminated
1344-28-1
68083-19-2
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Copper (Cu)
Tin (Sn)
Lead (Pb)
Silver (Ag)
BT Core
ABF
Solder Mask
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
51.10
27.00
16.00
0.90
2.00
3.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
99.15
0.85
70.00
30.00
96.50
3.00
0.50
44.97
0.08
0.11
0.52
43.68
9.53
1.11
Use in Product
Ceramic
Inner Electrode
Outer Electrode
Plating1
Plating2
Basis
Basis
Basis
Basis
Basis
Basis
Additive
Main Material
Main Material
Main Material
Main Material
Main Material
Main Material
Main Material
Component Weight/
Substance Weight
(grams)
0.011160
0.005703
0.003013
0.001786
0.000100
0.000223
0.000335
0.082000
Component
Percent of
Total
0.045
0.328
0.016400
0.012300
0.004100
0.004100
0.042230
0.000820
0.002050
14.214000
14.093181
0.120819
0.340000
0.238000
0.102000
1.607244
1.550990
0.048217
0.008036
7.770204
3.494261
0.006216
0.008547
0.040405
3.394025
0.740501
0.086249
56.913
1.361
6.435
31.112
PK558 (v1.1) November 23, 2012
www.xilinx.com
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