DS310 Datasheet, PDF (10/14 Pages) Xilinx, Inc – Available in multiple package options

XC2C32A CoolRunner-II CPLD
R
Ordering Information
Part Number
Pin/Ball
θ_JA
θ_JC
Spacing (°C/Watt) (°C/Watt)
Package Type
Package Body
Comm. (C)
Dimensions I/O Ind. (I)⁽¹⁾
XC2C32A-4QFG32C 0.5mm
35.5
24.0
Quad Flat No Lead; Pb-free
5mm x 5mm 21
C
XC2C32A-6QFG32C 0.5mm
35.5
24.0
Quad Flat No Lead; Pb-free
5mm x 5mm 21
C
XC2C32A-4VQ44C 0.8mm
47.7
8.2
Very Thin Quad Flat Pack
10mm x 10mm 33
C
XC2C32A-6VQ44C 0.8mm
47.7
8.2
Very Thin Quad Flat Pack
10mm x 10mm 33
C
XC2C32A-4CP56C 0.5mm
66.0
14.9
Chip Scale Package
6mm x 6mm 33
C
XC2C32A-6CP56C 0.5mm
66.0
14.9
Chip Scale Package
6mm x 6mm 33
C
XC2C32A-4VQG44C 0.8mm
47.7
8.2
Very Thin Quad Flat Pack; Pb-free 10mm x 10mm 33
C
XC2C32A-6VQG44C 0.8mm
47.7
8.2
Very Thin Quad Flat Pack; Pb-free 10mm x 10mm 33
C
XC2C32A-4CPG56C 0.5mm
66.0
14.9
Chip Scale Package; Pb-free
6mm x 6mm 33
C
XC2C32A-6CPG56C 0.5mm
66.0
14.9
Chip Scale Package; Pb-free
6mm x 6mm 33
C
XC2C32A-6QFG32I 0.5mm
35.5
24.0
Quad Flat No Lead; Pb-free
5mm x 5mm 21
I
XC2C32A-6VQ44I
0.8mm
47.7
8.2
Very Thin Quad Flat Pack
10mm x 10mm 33
I
XC2C32A-6CP56I
0.5mm
66.0
14.9
Chip Scale Package
6mm x 6mm 33
I
XC2C32A-6VQG44I 0.8mm
47.7
8.2
Very Thin Quad Flat Pack; Pb-free 10mm x 10mm 33
I
XC2C32A-6CPG56I 0.5mm
66.0
14.9
Chip Scale Package; Pb-free
6mm x 6mm 33
I
Notes:
1. C = Commercial (TA = 0°C to +70°C); I = Industrial (TA = –40°C to +85°C)
Standard Example: XC2C128 -4 TQ
Device
Speed Grade
Package Type
Number of Pins
Temperature Range
144 C
Pb-Free Example: XC2C128 -4 TQ
Device
Speed Grade
Package Type
Pb-Free
Number of Pins
Temperature Range
G 144 C
Device Part Marking
Device Type
Package
Speed
Operating Range
R
XC2Cxxx
TQ144
7C
This line not
related to device
part number
Part marking for non-chip scale package
Figure 5: Sample Package with Part Marking
DS310_05_102108
Note: Due to the small size of chip scale and quad flat no lead packages, the complete ordering part number cannot be
included on the package marking. Part marking on chip scale and quad flat no lead packages by line are:
• Line 1 = X (Xilinx logo) then truncated part number
• Line 2 = Not related to device part number
• Line 3 = Not related to device part number
• Line 4 = Package code, speed, operating temperature,
three digits not related to device part number. Package
codes: C3 = CP56, C4 = CPG56, Q1 = QFG32.
10
www.xilinx.com
DS310 (v2.1) November 6, 2008
Product Specification