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XC7V585T-3FFG1761E Datasheet, PDF (1/16 Pages) Xilinx, Inc – 7 Series FPGAs Overview
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7 Series FPGAs Overview
DS180 (v1.13) November 30, 2012
Advance Product Specification
General Description
Xilinx® 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form
factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most
demanding high-performance applications. The 7 series devices are the programmable silicon foundation for Targeted Design Platforms that enable
designers to focus on innovation from the outset of their development cycle. The 7 series FPGAs include:
• Artix™-7 Family: Optimized for lowest cost and power with small
form-factor packaging for the highest volume applications.
• Kintex™-7 Family: Optimized for best price-performance with a 2X
improvement compared to previous generation, enabling a new class
of FPGAs.
• Virtex®-7 Family: Optimized for highest system performance and
capacity with a 2X improvement in system performance. Highest
capability devices enabled by stacked silicon interconnect (SSI)
technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an
unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less
power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs. All 7 series devices share a scalable, optimized
fourth-generation Advanced Silicon Modular Block (ASMBL™) column-based architecture that reduces system development and deployment time with
simplified design portability.
Summary of 7 Series FPGA Features
• Advanced high-performance FPGA logic based on real 6-input look-
up table (LUT) technology configurable as distributed memory.
• 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data
buffering.
• High-performance SelectIO™ technology with support for DDR3
interfaces up to 1,866 Mb/s.
• High-speed serial connectivity with built-in multi-gigabit transceivers
from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s,
offering a special low-power mode, optimized for chip-to-chip
interfaces.
• A user configurable analog interface (XADC), incorporating dual
12-bit 1MSPS analog-to-digital converters with on-chip thermal and
supply sensors.
• DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder
for high performance filtering, including optimized symmetric
coefficient filtering.
Table 1: 7 Series Families Comparison
• Powerful clock management tiles (CMT), combining phase-locked
loop (PLL) and mixed-mode clock manager (MMCM) blocks for high
precision and low jitter.
• Integrated block for PCI Express® (PCIe), for up to x8 Gen3
Endpoint and Root Port designs.
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-256
authentication, and built-in SEU detection and correction.
• Low-cost, wire-bond, lidless flip-chip, and high signal integrity flip-
chip packaging offering easy migration between family members in
the same package. All packages available in Pb-free and selected
packages in Pb option.
• Designed for high performance and lowest power with 28 nm,
HKMG, HPL process, 1.0V core voltage process technology and
0.9V core voltage option for even lower power.
Maximum Capability
Artix-7 Family
Logic Cells
Block RAM(1)
215K
13 Mb
DSP Slices
740
Peak DSP Performance(2)
929 GMAC/s
Transceivers
16
Peak Transceiver Speed
6.6 Gb/s
Peak Serial Bandwidth (Full Duplex)
211 Gb/s
PCIe Interface
x4 Gen2
Memory Interface
1,066 Mb/s
I/O Pins
500
I/O Voltage
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Package Options
Low-Cost, Wire-Bond, Lidless
Flip-Chip
Kintex-7 Family
478K
34 Mb
1,920
2,845 GMAC/s
32
12.5 Gb/s
800 Gb/s
x8 Gen2
1,866 Mb/s
500
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Low-Cost, Lidless Flip-Chip and
High-Performance Flip-Chip
Virtex-7 Family
1,955K
68 Mb
3,600
5,335 GMAC/s
96
28.05 Gb/s
2,784 Gb/s
x8 Gen3
1,866 Mb/s
1,200
1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Highest Performance Flip-Chip
Notes:
1. Additional memory available in the form of distributed RAM.
2. Peak DSP performance numbers are based on symmetrical filter implementation.
© Copyright 2010–2012 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Zynq, and other designated brands included herein are trademarks of Xilinx in the
United States and other countries. PCI Express is a trademark of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
DS180 (v1.13) November 30, 2012
www.xilinx.com
Advance Product Specification
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