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XC6VLX130T-1FFG1156I Datasheet, PDF (1/65 Pages) Xilinx, Inc – DC and Switching Characteristics
DS152 (v3.5) May 17, 2013
Virtex-6 FPGA Data Sheet:
DC and Switching Characteristics
Product Specification
Virtex-6 FPGA Electrical Characteristics
Virtex®-6 FPGAs are available in -3, -2, -1, and -1L speed grades, with -3 having the highest performance. Virtex-6 FPGA
DC and AC characteristics are specified in commercial, extended, industrial, and military temperature ranges. Unless noted,
the Virtex-6Q FPGA DC and AC characteristics are equivalent to the commercial specifications. Except for the operating
temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed
grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade
commercial device). However, only selected speed grades and/or devices are available in the extended, industrial, or military
temperature ranges.
All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters
included are common to popular designs and typical applications.
Available device and package combinations can be found at:
• DS150: Virtex-6 Family Overview
• DS155: Defense-Grade Virtex-6Q Family Overview
This Virtex-6 FPGA data sheet, part of an overall set of documentation on the Virtex-6 FPGAs, is available on the Xilinx
website at: http://www.xilinx.com/support/index.html/content/xilinx/en/supportNav/silicon_devices/fpga/virtex-6.html.
Virtex-6 FPGA DC Characteristics
Table 1: Absolute Maximum Ratings (1)
Symbol
Description
Units
VCCINT
Internal supply voltage relative to GND
For -1L devices: Internal supply voltage relative to GND
–0.5 to 1.1
V
–0.5 to 1.0
V
VCCAUX
Auxiliary supply voltage relative to GND
–0.5 to 3.0
V
VCCO
Output drivers supply voltage relative to GND
–0.5 to 3.0
V
VBATT
Key memory battery backup supply
–0.5 to 3.0
V
VFS
External voltage supply for eFUSE programming(2)
–0.5 to 3.0
V
VREF
Input reference voltage
–0.5 to 3.0
V
VIN(3)
2.5V or below I/O input voltage relative to GND(4) (user and dedicated I/Os)
–0.5 to VCCO + 0.5
V
VTS
Voltage applied to 3-state 2.5V or below output(4) (user and dedicated I/Os)
–0.5 to VCCO + 0.5
V
TSTG
TSOL
Storage temperature (ambient)
Maximum soldering temperature(5)
–65 to 150
°C
+220
°C
Tj
Maximum junction temperature(5)
+125
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. When not programming eFUSE, connect VFS to GND.
3. 2.5V I/O absolute maximum limit applied to DC and AC signals.
4. For I/O operation, refer to UG361:Virtex-6 FPGA SelectIO Resources User Guide.
5. For soldering guidelines and thermal considerations, see UG365:Virtex-6 FPGA Packaging and Pinout Specification.
© 2009–2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Zynq, Artix, Kintex, Spartan, ISE, Vivado and other designated brands included herein are trademarks of Xilinx in the
United States and other countries. All other trademarks are the property of their respective owners.
DS152 (v3.5) May 17, 2013
www.xilinx.com
Product Specification
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