PK814 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :3.6759g

100% Material Declaration Data Sheet for RS484
PK814 (v1.0) October 7, 2016
Average Weight :
3.6759 g
Component
Silicon die
Bump
Underfill
Solder ball
Heat sink
Substrate
Substance Description
CAS # or Description % of
Use in product
component
Silicon
Tin
Lead
Bisphenol F/ epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type liquid epoxy
Amine type accelerator
Silicon dioxide
Carbon black
Additives
Tin
Lead
Copper
Nickel
Copper
Tin
Lead
Core (HL832NS)
ABF (GX13)
Solder Mask (SR7200G)
NA
7440-31-5
7439-92-1
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7439-92-1
7440-50-8
8049-31-8
7440-50-8
7440-31-5
7439-92-1
N/A
N/A
N/A
100
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
63.00
37.00
97.94
2.06
36.82
1.09
0.42
47.89
11.25
2.54
basis
basis
basis
basis
basis
basis
basis
filler
color agent
additives
Main material
Main material
Main material
Main material
Component weight /
substance weight ( in
grams)
0.237468
0.237468
0.011261
0.007094
0.004167
0.035000
0.007000
0.005250
0.001750
0.001750
0.018025
0.000350
0.000875
0.222192
0.139981
0.082211
2.190000
2.144886
0.045114
0.980000
0.360836
0.010682
0.004116
0.469322
0.110250
0.024892
Component
% of total
6.460%
0.306%
0.952%
6.045%
59.577%
26.660%
Revision History
Date
10/7/2016
Version
1.0
Description of
Revisions
Initial Xilinx release.
© Copyright 2016 Xilinx