PK812 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :13.7700g

100% Material Declaration Data Sheet for RF1156, RF1157, RF1158
PK812 (v1.0) August 20, 2016
Component
Silicon die
Bump
Underfill
Solder paste
Capacitor 1
Capacitor 2
Capacitor 3
Capacitor 4
Heat sink
Heat sink adhesive
Solder ball
Substrate
Average Weight :
13.7700 g
Substance Description
CAS # or Description % of
Use in product
component
Silicon
Consigned
Bisphenol F/ epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type liquid epoxy
resin
Amine type accelerator
Silicon dioxide
Carbon black
Additives
Tin
Lead
Barium
Manganese
Nickel
Copper
Boron
Nickel
Tin
Lead
Barium
Manganese
Nickel
Copper
Glass oxide
Nickel
Tin
Lead
Barium
Manganese
Nickel
Copper
Boron
Nickel
Gold
Barium
Manganese
Nickel
Copper
Glass oxide
Nickel
Tin
Lead
Copper
Nickel
Aluminium Oxide Al2O3
Dimethyl siloxane, dimethylvinyl-
terminated
Tin
Lead
Copper
Tin
Lead
Core
ABF
Solder Mask
7440-21-3
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7439-92-1
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-31-5
7439-92-1
12047-27-7
1313-13-9
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-31-5
7439-92-1
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-57-5
12047-27-7
1313-13-9
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-31-5
7439-92-1
7440-50-8
7440-02-0
1344-28-1
68083-19-2
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
N/A
N/A
N/A
100.00
basis
20.00
15.00
5.00
5.00
51.50
1.00
2.50
63.00
37.00
88.86
1.43
4.29
0.70
0.01
3.57
0.90
0.24
88.86
1.43
4.29
0.70
0.01
3.57
0.86
0.29
71.29
10.43
2.00
11.57
0.21
1.80
2.70
72.00
11.00
4.00
6.00
0.00
3.00
4.00
0.00
98.35
1.65
70.00
30.00
basis
basis
basis
basis
basis
basis
Additive
metal
metal
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
Main material
Main material
Main material
Main material
63.00
37.00
39.84
0.52
0.31
38.63
19.00
1.71
Main material
Main material
Component weight /
substance weight ( in
grams)
0.829368
0.829368
0.038845
0.000000
0.086000
0.017200
0.012900
0.004300
0.004300
0.044290
0.000860
0.002150
0.005896
0.003714
0.001374
0.000920
0.000817
0.000013
0.000039
0.000006
0.000000
0.000033
0.000008
0.000002
0.003800
0.003377
0.000054
0.000163
0.000027
0.000001
0.000136
0.000033
0.000011
0.000310
0.000221
0.000032
0.000006
0.000036
0.000001
0.000006
0.000008
0.000920
0.000662
0.000101
0.000037
0.000055
0.000000
0.000028
0.000037
0.000000
7.380000
7.258230
0.121770
0.187000
0.130900
0.056100
1.100277
0.693175
0.407102
4.136664
1.648047
0.021511
0.012824
1.597993
0.785966
0.070737
Component
% of total
6.023%
0.282%
0.625%
0.043%
0.007%
0.028%
0.002%
0.007%
53.595%
1.358%
7.990%
30.041%
Revision History
Date
8/20/2016
Version
1.0
Description of
Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its
compliance with applicable environmental laws and regulations. Xilinx subcontracts
the production, test and assembly of hardware devices to independent third-party
vendors and materials suppliers (“Contractors”). All data provided hereunder is
based on information received from Contractors. Xilinx has not independently
verified the accuracy or completeness of this information which is provided solely for
your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx