PK810 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :33.9868g

100% Material Declaration Data Sheet for RF1930
PK810 (v1.0) June 23, 2016
Average Weight :
33.9868 g
Component
Substance Description
CAS # or Description % of
Use in product
component
Component weight /
substance weight ( in
grams)
Component
% of total
Silicon die
Bump
Silicon
Tin
Lead
7440-21-3
7440-31-5
7439-92-1
100.00
63.00
37.00
Basis
Basis
Basis
0.893576
0.893576
0.043334
0.027300
0.016034
0.093450
2.629%
0.128%
0.275%
Bisphenol F/ epichlorohydrin
copolymer
9003-36-5
20.00
Basis
0.018690
Phenolic resin
trade secret
15.00
Basis
0.014018
Underfill
Bisphenol A type liquid epoxy
resin
25068-38-6
5.00
Basis
0.004673
Amine type accelerator
trade secret
5.00
Basis
0.004673
Silicon dioxide
60676-86-0
51.50
Basis
0.048127
Carbon black
1333-86-4
1.00
Basis
0.000935
Solder Paste
Additives
Tin
Lead
Barium
trade secret
7440-31-5
7439-92-1
12047-27-7
2.50
63.00
37.00
88.86
Additive
Metal
Metal
Ceramic
0.002336
0.009288
0.005851
0.002165
0.041280
0.036680
0.027%
0.121%
Manganese
1313-13-9
1.43
Ceramic
0.000590
Nickel
7440-02-0
4.29 Internal Electrode
0.001769
Capacitor 1
Copper
Boron
7440-50-8
1303-86-2
0.70
Termination
0.01
Termination
0.000289
0.000006
Nickel
7440-02-0
3.57
Plating
0.001474
Tin
7440-31-5
0.90
Plating
0.000372
Lead
Barium
7439-92-1
12047-27-7
0.24
88.86
Plating
Ceramic
0.000100
0.016400
0.014573
0.048%
Manganese
1313-13-9
1.43
Ceramic
0.000234
Nickel
7440-02-0
4.29 Internal Electrode
0.000703
Capacitor 2
Copper
Glass oxide
7440-50-8
65997-17-3
0.70
Termination
0.01
Termination
0.000115
0.000002
Nickel
7440-02-0
3.57
Plating
0.000586
Tin
7440-31-5
0.86
Plating
0.000141
Lead
7439-92-1
0.29
Plating
0.000047
0
0.003125
0.009%
Barium
12047-27-7
71.29
Ceramic
0.002228
Manganese
1313-13-9
10.43
Ceramic
0.000326
Capacitor 3
Nickel
Copper
7440-02-0
7440-50-8
2.00
11.57
Internal Electrode
Termination
0.000063
0.000362
Boron
1303-86-2
0.21
Termination
0.000007
Nickel
7440-02-0
1.80
Plating
0.000056
Gold
Barium
7440-57-5
12047-27-7
2.70
Plating
0.72
Ceramic
0.000084
0.015456
0.000112
0.045%
Manganese
1313-13-9
0.11
Ceramic
0.000016
Nickel
7440-02-0
0.04 Internal Electrode
0.000006
Capacitor 4
Copper
Glass oxide
7440-50-8
65997-17-3
0.06
Termination
0.00
Termination
0.000009
0.000000
Nickel
7440-02-0
0.03
Plating
0.000004
Tin
7440-31-5
0.04
Plating
0.000006
Lead
Heat sink
Copper
Nickel
Heat sink adhesive
Aluminium Oxide Al2O3
Dimethyl siloxane, dimethylvinyl-
terminated
Solder ball
Tin
Lead
Substrate
Copper
Tin
Lead
Core
ABF
Solder mask
7439-92-1
7440-50-8
7440-02-0
1344-28-1
68083-19-2
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
N/A
N/A
N/A
0.00
98.35
1.65
70.00
30.00
63.00
37.00
39.00
0.30
0.20
40.00
18.00
1.40
Plating
Main material
Main material
Main material
Main material
Main material
Main material
0.000001
22.670000
22.295945
0.374055
0.228000
0.159600
0.068400
1.836968
1.157290
0.679678
8.109123
3.212024
0.026760
0.015407
3.271220
1.471806
0.111095
66.702%
0.671%
5.405%
23.860%
Revision History
Date
6/23/2016
Version
1.0
Description of
Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its
compliance with applicable environmental laws and regulations. Xilinx
subcontracts the production, test and assembly of hardware devices to
independent third-party vendors and materials suppliers (“Contractors”). All data
provided hereunder is based on information received from Contractors. Xilinx has
not independently verified the accuracy or completeness of this information which
is provided solely for your reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx