PK808 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :6.1500g

100% Material Declaration Data Sheet for SFVA784
PK808 (v1.0) June 16, 2016
Average Weight :
6.1500 g
Component
Silicon die
Bump
Underfill
Solder paste
Lid
Lid Adhesive
Solder ball
Capacitor 1
Capacitor2
Substrate
Revision History
Substance Description
CAS # or Description % of
Use in product
component
Si
Sn
Ag
Bisphenol F type liquid epoxy
1,6-Bis(2,3-
epoxypropoxy)naphthalene
Bisphenol A type liquid epoxy
resin
Amine type hardener
Silicon dioxide
Carbon black
Additives
Sn
Ag
Cu
Cu
Ni
Aluminium Oxide Al2O3
Dimethyl siloxane, dimethylvinyl-
terminated
Sn
Ag
Cu
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
Copper
Tin
Silver
Core
ABF
Solder Mask
7440-21-3
7440-31-5
7440-22-4
9003-36-5
27610-48-6
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-02-0
trade secret
68083-19-2
7440-31-5
7440-22-4
7440-50-8
1304-28-5
13463-67-7
-
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
1304-28-5
13463-67-7
trade secret
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
7440-50-8
7440-31-5
7440-22-4
N/A
N/A
N/A
100.00
98.20
1.80
15.00
10.00
5.00
10.00
58.00
1.00
1.00
96.50
3.00
0.50
99.64
0.36
80.00
20.00
96.50
3.00
0.50
30.22
15.11
5.04
33.44
11.87
1.06
0.26
0.81
2.19
31.67
15.83
5.28
26.67
15.10
1.34
0.33
1.00
2.78
31.29
0.85
0.03
49.97
15.72
2.14
basis
basis
basis
basis
basis
basis
basis
filler
color agent
additives
metal
metal
metal
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
Ceramic
Inner Electrode
Outer Electrode
Plating1
Plating2
Component weight /
substance weight ( in
grams)
Component
% of total
0.328554
0.328554
0.013405
0.013164
0.000241
0.048800
0.007320
5.342%
0.218%
0.004880
0.002440
0.004880
0.028304
0.000488
0.000488
0.007168
0.006917
0.000215
0.000036
3.360000
3.304560
0.055440
0.920000
0.736000
0.184000
0.379008
0.365743
0.011370
0.001895
0.001200
0.000363
0.000181
0.000060
0.000401
0.000142
0.000013
0.000003
0.000010
0.000026
0.000920
0.000291
0.000146
0.000049
0.000245
0.000139
0.000012
0.000003
0.000009
0.000026
1.090945
0.341357
0.009273
0.000327
0.545145
0.171497
0.023346
0.793%
0.117%
54.634%
14.959%
6.163%
0.020%
0.015%
17.739%
Date
6/16/2016
Version
1.0
Description of
Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its compliance
with applicable environmental laws and regulations. Xilinx subcontracts the production,
test and assembly of hardware devices to independent third-party vendors and
materials suppliers (“Contractors”). All data provided hereunder is based on information
received from Contractors. Xilinx has not independently verified the accuracy or
completeness of this information which is provided solely for your reference in
connection with the use of Xilinx products.
© Copyright 2016 Xilinx