PK800 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :2.7985g

100% Material Declaration Data Sheet for FBG676
PK800 (v1.0) Jun 23, 2016
Average Weight :
2.7985 g
Component
Silicon Die
Bump
Underfill
Solder ball
Substrate
Substance Description
CAS # or Description
% of
Use in product
component
Silicon
Tin
Lead
Bisphenol F/ epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type liquid epoxy
Amine type accelerator
Silicon dioxide
Carbon black
Additives
Tin
Silver
Cupper
Copper
Tin
Lead
Silver
Core
ABF
Solder Mask
NA 7440-21-3
7440-31-5
7439-92-1
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
100
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
96.50
3.00
0.50
36.45
0.91
0.20
0.02
48.71
11.22
2.49
basis
basis
basis
basis
basis
basis
basis
filler
color agent
additives
basis
basis
basis
Component weight /
substance weight ( in
grams)
0.237267
0.237267
0.011261
0.007094
0.004167
0.030000
0.006000
0.004500
0.001500
0.001500
0.015450
0.000300
0.000750
0.564707
0.544942
0.016941
0.002824
1.955293
0.712704
0.017793
0.003911
0.000391
0.952423
0.219384
0.048687
Component
% of total
8.478%
0.402%
1.072%
20.179%
69.869%
Revision History
Date
6/23/2016
Version
1.0
Description of
Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its compliance
with applicable environmental laws and regulations. Xilinx subcontracts the
production, test and assembly of hardware devices to independent third-party
vendors and materials suppliers (“Contractors”). All data provided hereunder is based
on information received from Contractors. Xilinx has not independently verified the
accuracy or completeness of this information which is provided solely for your
reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx