PK788 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :10.1412g

100% Material Declaration Data Sheet for FFV1136
PK788 (v1.0) Apr 1, 2016
Average Weight :
10.1412 g
Component
Silicon die
Bump
Underfill
Solder paste
Capacitor 1
Capacitor2
Lid
Lid adhesive
Solder ball
Substrate
Substance Description
CAS # or Description
% of
component
Si
7440-21-3
Sn
7440-31-5
Ag
7440-22-4
Bisphenol F type liquid epoxy resin
1,6-Bis(2,3-
epoxypropoxy)naphthalene
Bisphenol A type liquid epoxy resin
9003-36-5
27610-48-6
25068-38-6
Amine type hardener
Silicon dioxide
Carbon black
Additives
trade secret
60676-86-0
1333-86-4
trade secret
Sn
7440-31-5
Ag
7440-22-4
Cu
7440-50-8
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
1304-28-5
13463-67-7
-
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
1304-28-5
13463-67-7
-
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
Cu
7440-50-8
Ni
7440-02-0
Aluminium Oxide Al2O3
Dimethyl siloxane, dimethylvinyl-
terminated
-
68083-19-2
Sn
7440-31-5
Ag
7440-22-4
Cu
7440-50-8
Copper
Tin
Silver
Copper
Core
PP
ABF
Solder Mask
7440-50-8
7440-31-5
7440-22-4
7440-50-8
N/A
N/A
N/A
N/A
100.00
98.20
1.80
15.00
10.00
5.00
10.00
58.00
1.00
1.00
96.50
3.00
0.50
37.46
18.73
6.24
17.95
15.88
1.41
0.35
0.54
1.44
34.54
17.27
5.76
31.90
8.52
0.76
0.19
0.29
0.77
98.35
1.65
80.00
20.00
96.50
3.00
0.50
30.84
1.13
0.10
0.04
45.88
6.02
14.00
2.00
Use in product
basis
basis
basis
basis
basis
basis
basis
filler
color agent
additives
metal
metal
metal
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
Ceramic
Inner Electrode
Outer Electrode
Plating1
Plating2
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Component weight /
Component %
substance weight ( in grams) of total
0.248141
0.248141
0.007755
0.007615
0.000140
0.040000
0.006000
0.004000
2.447%
0.076%
0.002000
0.004000
0.023200
0.000400
0.000400
0.006464
0.006238
0.000194
0.000032
0.057600
0.021577
0.010788
0.003594
0.010339
0.009147
0.000812
0.000202
0.000311
0.000829
0.013760
0.004753
0.002376
0.000793
0.004389
0.001172
0.000105
0.000026
0.000040
0.000106
5.095800
5.011719
0.084081
0.116400
0.093120
0.023280
0.951543
0.918239
0.028546
0.004758
3.603537
1.111331
0.040720
0.003604
0.001441
1.653303
0.216933
0.504495
0.072071
0.394%
0.064%
0.568%
0.136%
50.249%
1.148%
9.383%
35.534%
Revision History
Date
04/01/2016
Version
1
Description of Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or
completeness, including, but not limited to, with respect to its compliance with applicable
environmental laws and regulations. Xilinx subcontracts the production, test and assembly of
hardware devices to independent third-party vendors and materials suppliers (“Contractors”). All
data provided hereunder is based on information received from Contractors. Xilinx has not
independently verified the accuracy or completeness of this information which is provided solely
for your reference in connection with the use of Xilinx products.