PK784 Datasheet, PDF (1/1 Pages) Xilinx, Inc – Average Weight :32.3533g

100% Material Declaration Data Sheet for FFVA2104
PK784 (v1.0) Mar 18, 2016
Average Weight :
32.3533 g
Component
Silicon die
Bump
Underfill
Solder paste
Capacitor 1
Capacitor2
Lid
Lid Adhesive
Solder ball
Substrate
Revision History
Substance Description
CAS # or Description % of
component
Use in product
Si
Sn
Ag
Bisphenol F type liquid epoxy
1,6-Bis(2,3-
epoxypropoxy)naphthalene
Bisphenol A type liquid epoxy
Amine type hardener
Silicon dioxide
Carbon black
Additives
Sn
Ag
Cu
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
BaTiO3 type
Titanium dioxide
Misc
Ni
Cu
Silicon dioxide
diboron trioxide; boric oxide
Ni
Sn
Cu
Ni
Aluminium Oxide Al2O3
Dimethyl siloxane, dimethylvinyl-
terminated
Sn
Ag
Cu
Cu
Sn
Ag
BT Core
ABF
Solder Mask
7440-21-3
7440-31-5
7440-22-4
9003-36-5
27610-48-6
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
7440-31-5
7440-22-4
7440-50-8
1304-28-5
13463-67-7
-
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
1304-28-5
13463-67-7
-
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
7440-50-8
7440-02-0
-
68083-19-2
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-31-5
7440-22-4
N/A
N/A
N/A
100.00
98.20
1.80
15.00
10.00
5.00
10.00
58.00
1.00
1.00
96.50
3.00
0.50
30.22
15.11
5.04
33.44
11.87
1.06
0.26
0.81
2.19
31.67
15.83
5.28
26.67
15.10
1.34
0.33
1.00
2.78
98.35
1.65
80.00
20.00
96.50
3.00
0.50
43.33
0.53
0.02
36.28
18.58
1.26
basis
basis
basis
basis
basis
basis
basis
filler
color agent
additives
metal
metal
metal
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
Ceramic
Inner Electrode
Outer Electrode
Plating1
Plating2
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Component weight /
substance weight ( in
grams)
Component
% of total
0.731163
0.731163
0.028328
0.027818
0.000510
0.078000
0.011700
2.260%
0.088%
0.241%
0.007800
0.003900
0.007800
0.045240
0.000780
0.000780
0.017728
0.017108
0.000532
0.000089
0.040800
0.012330
0.006165
0.002056
0.013644
0.004843
0.000432
0.000106
0.000330
0.000894
0.028520
0.009032
0.004515
0.001506
0.007606
0.004307
0.000382
0.000094
0.000285
0.000793
20.136700
19.804444
0.332256
0.255000
0.204000
0.055%
0.126%
0.088%
62.240%
0.788%
0.051000
1.757610
1.696094
0.052728
0.008788
9.279451
4.020786
0.049181
0.001856
3.366585
1.724122
0.116921
5.433%
28.682%
Date
03/18/2016
Version
1
Description of
Revisions
Initial Xilinx release.
Notice of Disclaimer
Xilinx regards this materials data to be correct but makes no guarantee as to its
accuracy or completeness, including, but not limited to, with respect to its compliance
with applicable environmental laws and regulations. Xilinx subcontracts the production,
test and assembly of hardware devices to independent third-party vendors and
materials suppliers (“Contractors”). All data provided hereunder is based on
information received from Contractors. Xilinx has not independently verified the
accuracy or completeness of this information which is provided solely for your
reference in connection with the use of Xilinx products.
© Copyright 2016 Xilinx