PK772 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.1360 g

100% Material Declaration Data Sheet for
7 Series CL484 Package
PK772 (v1.0) November 13, 2015
Average Weight: 1.1360 g
Component
Silicon Die
Die Attach
Material
Mold
Compound
Copper Wire
Solder Ball
Substrate
Substance
Description
CAS Number or Percentage of
Description
Component
Use in Product
Silicon
7440-21-3
100.00
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon black
Silica fused
Silica Dioxide
Silica, crystalline
Trade secret
Trade secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Copper
Palladium
7440-50-8
7440-05-3
Tin
Lead
7440-31-5
7439-92-1
Gold
Nickel
Copper
Glass Fiber
Non halogen fire
retardant
BT Core
Solder Mask
7440-57-5
7440-02-0
7440-50-8
65997-17-3
Trade Secret
105391-33-1/
25722-66-1/
Trade Secret
34590-94-8/
7727-43-7/
Trade Secret
77.50
15.00
7.50
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
98.20
1.80
63.00
37.00
0.21
1.22
44.30
21.20
0.01
25.91
7.17
Component Weight/
Substance Weight
(grams)
0.025878
0.025878
0.008105
0.006281
0.001216
0.000608
0.476919
0.023846
0.014308
0.014308
0.014308
0.001431
0.335751
0.071538
0.001431
0.006315
0.006201
0.000114
0.233980
0.147407
0.086573
0.384804
0.000808
0.004695
0.170468
0.081578
0.000038
0.099703
0.027590
Component
Percent of
Total
2.278
0.713
41.981
0.556
20.596
33.872
© Copyright 2015 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK772 (v1.0) November 13, 2015
www.xilinx.com
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