PK764 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.383 g

PK764 (v1.1) Jan 8, 2016
100% Material Declaration Data Sheet
Spartan®-6 Cu Wire CSG225 Package
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Copper Wire
Mold
Compound
Solder Balls
Silicon
Silver
Bismaleimide
monomer
Acrylate monomer
Cu
Pd
Epoxy Resin
Phenol Resin A
Phenol Resin B
Silica
(Amorphous) A
Silica
(Amorphous) B
Metal Hydroxide
Carbon black
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-21-3
7440-22-4
Trade Secret
Trade Secret
7440-50-8
7440-05-3
Trade secret
9003-35-4
Trade secret
60676-86-0
7631-86-9
Trade secret
1333-86-4
7440-31-5
7440-22-4
7440-50-8
Average Weight: 0.383 g
% of
Component
100.00
77.50
15.00
7.50
98.25
1.75
7.50
3.00
3.00
67.95
15.00
3.00
0.55
96.50
3.00
0.50
Use in Product
Main material
Main material
Main material
Main material
Main material
Dopant
Main material
Main material
Main material
Filler
Filler
Flame retardant
Color agent
Main material
Main material
Main material
Component Weight/
Substance Weight
(in grams)
0.007758
0.007758
0.002083
0.001614
0.000312
0.000156
0.001834
0.001802
0.000032
0.170822
0.012812
0.005125
0.005125
0.116074
0.025623
0.005125
0.000940
0.055691
0.053742
0.001671
0.000278
Component %
of Total
2.026%
0.544%
0.479%
44.601%
14.541%
PK764 (v1.1) Jan 8, 2016
www.xilinx.com
1