PK738 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 4.11 g

PK738 (v1.0) May 29, 2015
100% Material Declaration Data Sheet
Spartan®-6 Cu Wire FGG900 Package
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Copper Wire
Mold
Compound
Solder Balls
Silicon
Silver
Bismaleimide
monomer
Acrylate monomer
Cu
Pd
Epoxy Resin
Phenol Resin A
Phenol Resin B
Silica(Amorphous)
A
Silica(Amorphous)
B
Metal Hydroxide
Carbon black
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-21-3
7440-22-4
Trade Secret
Trade Secret
7440-50-8
7440-05-3
Trade secret
9003-35-4
Trade secret
60676-86-0
7631-86-9
Trade secret
1333-86-4
7440-31-5
7440-22-4
7440-50-8
Average Weight: 4.11 g
% of
Component
100.00
77.50
15.00
7.50
98.25
1.75
3.00
3.00
3.00
72.45
Use in Product
Main material
Main material
Main material
Main material
Main material
Dopant
Main material
Main material
Main material
Filler
Component Weight/
Substance Weight
(in grams)
0.090946
0.090946
0.016016
0.012412
0.002402
0.001201
0.008441
0.008293
0.000148
1.878392
0.056352
0.056352
0.056352
1.360895
Component %
of Total
2.213%
0.390%
0.205%
45.703%
15.00
3.00
0.55
96.50
3.00
0.50
Filler
Flame retardant
Color agent
Main material
Main material
Main material
0.281759
0.056352
0.010331
0.751829
0.725515
0.022555
0.003759
18.293%
© Copyright 2015 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK738 (v1.0) May 29, 2015
www.xilinx.com
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