PK696 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.1679 g

PK696 (v1.0) Jan 16, 2015
100% Material Declaration Data Sheet for
Artix^®-7 Device FB484 Package
Component
Silicon Die
Solder Bump
Underfill
Solder Ball
Substrate
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
Tin
Lead
7440-31-5
7439-92-1
Bisphenol F/
epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
Tin
Lead
Copper
Tin
Lead
Silver
BT Core
ABF
Solder Mask
7440-31-5
7439-92-1
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
100.00
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
63.00
37.00
36.83
1.11
0.27
0.02
48.18
11.12
2.48
Average Weight: 2.1679 g
Use in Product
Component Weight/
Substance Weight
(grams)
0.237267
0.237267
0.011261
0.007094
0.004167
0.030000
Component
Percent of
Total
10.945
0.519
1.384
0.006000
0.004500
0.001500
0.001500
0.015450
0.000300
0.000750
0.460670
0.290222
0.170448
1.428700
0.526149
0.015854
0.003878
0.000288
0.688304
0.158840
21.250
65.903
© Copyright 2015 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK696 (v1.0) Jan 16, 2015
www.xilinx.com
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