PK684 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.3524 g

PK684 (v1.0) Nov 21, 2014
100% Material Declaration Data Sheet for 7
Series FG484 Package
Average Weight: 2.3524 g
Component
Silicon Die
Die Attach Material
Mold Compound
Copper Wire
Solder Ball
Substrate
Substance
Description
Silicon
Silver
Bismaleimide
monomer
Acrylate monomer
Solid Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
Silica fused
Silicon Dioxide
Silica, crystalline
Copper
Palladium
Tin
Lead
Gold (Au)
Nickel (Ni)
Copper Foil
Copper Plating
BT Core
Solder Mask
CAS Number
or
Description
% of
Component
Use in Product
7440-21-3
7440-22-4
100.00
77.50
Component Weight/
Substance Weight
(in grams)
0.048674
0.048674
0.008859
0.006866
Component %
of Total
2.069%
0.377%
Trade Secret
15.00
0.001329
Trade Secret
7.50
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
7440-50-8
7440-05-3
98.25
1.75
7440-31-5
7439-92-1
63.00
37.00
7440-57-5
7440-02-0
7440-50-8
7440-50-8
Trade Secret
Trade Secret
1.99
6.09
7.65
37.77
40.67
5.83
0.000664
1.125465
0.056273
0.033764
0.033764
0.033764
0.003376
0.792327
0.168820
0.003376
0.006997
0.006875
0.000122
0.460670
0.290222
0.170448
0.701689
0.013964
0.042733
0.053679
0.265028
0.285377
0.040908
47.844%
0.297%
19.583%
29.829%
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PK684 (v1.0) Nov 21, 2014
www.xilinx.com
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