PK682 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 5.5549 g

PK682 (v1.0) Oct 31, 2014
100% Material Declaration Data Sheet for
Zynq®-7000 RB484 Package
Component
Silicon Die
Solder Bump
Underfill
Solder Paste
Capacitor 1
Average Weight: 5.5549 g
Substance
Description
CAS Number or Percentage of
Description
Component
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
Silicon
7440-21-3
Tin
Lead
7440-31-5
7439-92-1
Bisphenol F/
Epichlorohydrin
Phenolic Resin
Bisphenol A type
liquid epoxy resin
Amine type
accelerator
Silicon Dioxide
Carbon Black
Additives
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
Tin
Lead
7440-31-5
7439-92-1
Barium
Manganese
Nickel
Copper
Glass oxide
Nickel
Gold
12047-27-7
1313-13-9
7440-02-0
7440-50-8
65997-17-3
7440-02-0
7440-57-5
100.00
63.00
37.00
Basis
Basis
Basis
20.00
15.00
5.00
5.00
51.50
1.00
2.50
Basis
Basis
Basis
Basis
Basis
Basis
Additive
63.00
37.00
Metal
Metal
71.29
10.43
2.00
11.57
0.21
1.80
2.70
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
0.156648
0.156648
0.007775
0.004898
0.002877
0.027300
0.005460
0.004095
0.001365
0.001365
0.014060
0.000273
0.000683
0.004664
0.002938
0.001726
0.000600
0.000428
0.000063
0.000012
0.000069
0.000001
0.000011
0.000016
2.820%
0.140%
0.491%
0.084%
0.011%
© Copyright 2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK682 (v1.0) Oct 31, 2014
www.xilinx.com
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