PK676 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 2.748g

PK676 (v1.0) Oct 3, 2014
100% Material Declaration Data Sheet for
Spartan-3AN FG676 Cu Wire Package
Component
Silicon Die 1
Silicon Die 2
Die Attach
Film
Mold
Compound
Gold Wire
Copper Wire
Solder Ball
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade secret
Trade secret
Solid Epoxy Resin
Phenol Resin
Amorphous Silica
Synthetic Rubber
NA
NA
7631-86-9
NA
Epoxy Resin
Silica(Amorphous)
A
Silica(Amorphous)
B
Metal Hydroxide
Carbon black
Trade secret
60676-86-0
7631-86-9
Trade secret
1333-86-4
Gold
Palladium
Calcium
7440-57-5
7440-05-3
7440-70-2
Copper
Palladium
7440-50-8
7440-05-3
Tin
Lead
7440-31-5
7439-92-1
100.00
100.00
77.50
15.00
7.50
12.50
12.50
35.00
40.00
9.00
72.45
15.00
3.00
0.55
99.048
0.95
0.002
98.25
1.75
63.00
37.00
Average Weight: 2.748g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.037747
0.037747
0.002919
0.002919
0.006967
0.005399
0.001045
0.000523
0.000017
0.000002
0.000002
0.000006
0.000007
1.421610
0.127945
1.029956
1.374%
0.106%
0.254%
0.001%
51.729%
0.213242
0.042648
0.007819
0.000233
0.000231
0.000002
0.000000
0.007971
0.007832
0.000139
0.643415
0.405351
0.238064
0.009%
0.290%
23.412%
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PK676 (v1.0) Oct 3, 2014
www.xilinx.com
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