PK670 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.7530 g

PK670 (v1.0) Oct 3, 2014
100% Material Declaration Data Sheet for
Spartan-3AN FTG256 Cu Wire Package
Average Weight: 0.7530 g
Component
Silicon Die 1
Silicon Die 2
Die Attach
Film
Mold
Compound
Copper Wire
Gold Wire
Solder Ball
Substance
Description
CAS Number or Percentage of
Description
Component
Use in Product
Silicon
7440-21-3
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
trade secret
trade secret
Solid Epoxy Resin
Phenol Resin
Amorphous Silica
Synthetic Rubber
NA
NA
7631-86-9
NA
Epoxy Resin
Phenol Resin A
Phenol Resin B
Silica
(Amorphous) A
Silica
(Amorphous) B
Metal Hydroxide
Carbon black
Trade secret
9003-35-4
Trade secret
60676-86-0
7631-86-9
Trade secret
1333-86-4
Copper
Palladium
7440-50-8
7440-05-3
Gold
Palladium
Calcium
Tin
Silver
Copper
7440-57-5
7440-05-3
7440-70-2
7440-31-5
7440-22-4
7440-50-8
100.00
100.00
77.50
15.00
7.50
12.50
12.50
35.00
40.00
7.50
3.00
3.00
67.95
15.00
3.00
0.55
98.25
1.75
99.05
0.95
0.00
95.50
4.00
0.50
Component Weight/
Substance Weight
(grams)
0.010425
0.010425
0.001608
0.001608
0.002719
0.002107
0.000408
0.000204
0.000007
0.000001
0.000001
0.000002
0.000003
0.392035
0.029403
0.011761
0.011761
0.266388
0.058805
0.011761
0.002156
0.002610
0.002564
0.000046
0.000222
0.000220
0.000002
0.000000
0.124093
0.118509
0.004964
0.000620
Component
Percent of
Total
1.384%
0.214%
0.361%
0.001%
52.063%
0.347%
0.029%
16.480%
© Copyright 2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK670 (v1.0) Oct 3, 2014
www.xilinx.com
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