PK662 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 1.294 g

PK662 (v1.0) Aug 22, 2014
100% Material Declaration Data Sheet for
Spartan-3AN TQG144 Cu Wire Package
Component
Silicon Die 1
Silicon Die 2
Die Attach
Mold
Compound
Copper Wire
Gold Wire
Lead Frame
Tape
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
100.00
Silicon
7440-21-3
Solid Epoxy
Resin
Phenol Resin
Amorphous
Silica
Synthetic
Rubber
NA
NA
7631-86-9
NA
Epoxy Resin
Phenol Resin
Silica(Amorphou
s) A
Silica(Amorphou
s) B
Carbon Black
Trade Secret
Trade Secret
60676-86-0
7631-86-9
1333-86-4
100.00
12.50
12.50
35.00
40.00
10.00
5.00
74.00
10.00
1.00
Copper
Palladium
7440-50-8
7440-05-3
98.25
1.75
Gold
Palladium
Calcium
7440-57-5
7440-05-3
7440-70-2
Polyimide
Poly-ethlene-
terephthalate
NBR
Bismaleimide
Phenol resin
Trade secret
25038-59-9
9003-18-3
79922-55-7
28453-20-5
99.05
0.95
0.00
43.00
38.00
7.00
6.00
6.00
Average Weight: 1.294 g
Use in Product
Component Weight/
Substance Weight
(grams)
0.003870
0.003870
0.001158
0.001158
0.000960
0.000120
0.000120
0.000336
Component
Percent of
Total
0.299%
0.090%
0.074%
0.000384
1.114842
0.111484
0.055742
0.824983
86.155%
0.111484
0.011148
0.001247
0.001225
0.000022
0.000135
0.000134
0.000001
0.000000
0.006000
0.002580
0.002280
0.000420
0.000360
0.000360
0.096%
0.010%
0.464%
© Copyright 2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK662 (v1.0) Aug 22, 2014
www.xilinx.com
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