PK658 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 9.5270g

PK658 (v1.0) May 23, 2014
100% Material Declaration Data Sheet for
Artix-7 FFG1156
Component
Silicon Die
Solder Bump
Underfill
Lid
Lid Adhesive
Solder Ball
Substance
Description
CAS Number
or
Description
Percent of
Component
(%)
Silicon (Si)
7440-21-3
100.00
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
63.00
37.00
Bisphenol F/
epichlorohydrin
copolymer
Phenolic Resin
Bisphenol A type liquid
epoxy resin
Amine type accelerator
Silicon Dioxide
Carbon Black
Additives
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
20.00
15.00
5.00
5.00
51.50
1.00
2.50
Copper (Cu)
Nickel (Ni)
7440-50-8
7440-02-0
Aluminium Oxide
Al2O3
Dimethyl siloxane,
dimethylvinyl-
terminated
1344-28-1
68083-19-2
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
99.35
1.65
70.00
30.00
96.50
3.00
0.50
Average Weight: 9.5270g
Use in Product
Basis
Basis
Basis
Component Weight/
Substance Weight
(grams)
0.237267
0.237267
0.011261
0.007094
0.004167
0.030000
Component
Percent of
Total (%)
2.490
0.118
0.315
Basis
0.006000
Basis
Basis
Basis
Basis
Basis
Additive
Main Material
Main Material
Main Material
0.004500
0.001500
0.001500
0.015450
0.000300
0.000750
4.965400
4.883471
0.081929
0.116000
0.081200
52.119
1.218
Main Material
Main Material
Main Material
Main Material
0.034800
0.964719
0.930954
0.028942
0.004824
10.126
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PK658 (v1.0) May 23, 2014
www.xilinx.com
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