PK654 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 0.2714g

PK654 (v1.0) May 5, 2014
100% Material Declaration Data Sheet for
7 Series CPG236 Package
Component
Silicon Die
Silver Epoxy
Copper Wire
Mold
Compound
Solder Ball
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Copper
Palladium
7440-50-8
7440-05-3
Epoxy Resin
Phenol Resin A
Phenol Resin B
Silica
(Amorphous) A
Silica
(Amorphous) B
Metal Hydroxide
Carbon Black
Trade Secret
9003-35-4
Trade Secret
60676-86-0
7631-86-9
Trade Secret
1333-86-4
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
100.00
77.50
15.00
7.50
98.25
1.75
7.50
3.00
3.00
67.95
15.00
3.00
0.55
98.50
1.00
0.50
Average Weight: 0.2714g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.017861
0.017861
0.005739
0.004448
0.000861
0.000430
0.002744
0.002696
0.000048
0.120617
0.009046
0.003619
0.003619
0.081959
6.580
2.110
1.010
44.440
0.018093
0.003619
0.000663
0.024684
0.024314
0.000247
0.000123
9.100
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PK654 (v1.0) May 5, 2014
www.xilinx.com
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