PK636 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.0975g

PK636 (v1.0) January 21, 2014
100% Material Declaration Data Sheet for
7 Series CLG485 Package
Component
Silicon Die
Die Attach
Epoxy
Mold
Compound
Copper Wire
Solder Ball
Substrate
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
100.00
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Epoxy Resin
Phenol Resin A
Phenol Resin B
Silica
(Amorphous) A
Silica
(Amorphous) B
Metal Hydroxide
Carbon Black
Copper
Palladium
Trade Secret
9003-35-4
Trade Secret
60676-86-0
7631-86-9
Trade Secret
1333-86-4
7440-50-8
7440-05-3
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Gold
Nickel
Copper Foil
Copper Plating
Fiber Glass
Non Halogen Fire
Retardant
BT Core
Solder Mask
7440-57-5
7440-02-0
7440-50-8
7440-50-8
65997-17-3
Trade Secret
105391-33-1 /
25722-66-1 /
9003-36-5 /
21645-51-2
34590-94-8 /
7727-43-7
77.50
15.00
7.50
7.50
3.00
3.00
67.95
15.00
3.00
0.55
98.25
1.75
96.50
3.00
0.50
0.21
1.96
18.76
27.06
12.72
0.01
32.89
6.39
Average Weight: 1.0975g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.023735
0.023735
2.163
0.007472
0.681
0.005791
0.001121
0.000560
0.479116
0.035934
0.014374
0.014374
43.655
0.325559
0.071867
0.014374
0.002635
0.006404
0.006292
0.000112
0.233980
0.225791
0.007019
0.001170
0.346793
0.000738
0.006809
0.065043
0.093831
0.044118
0.000035
0.584
21.319
31.598
0.114054
0.022165
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK636 (v1.0) January 21, 2014
www.xilinx.com
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