PK630 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 1.3890 g

PK630 (v1.0) December 3, 2013
100% Material Declaration Data Sheet for
7 Series SBG485 Package
Component
Substance
Description
Silicon Die
Solder Bump
Underfill
Solder Paste
Capacitor 1
Capacitor 2
Silicon
Tin
Lead
Bisphenol F/
epichlorohydrin
copolymer
Phenolic Resin
Bisphenol A type
liquid epoxy resin
Amine type
accelerator
Silicon Dioxide
Carbon Black
Additives
Tin
Silver
Copper
BaTi03
Nickel
Copper
Nickel
Tin
BaTi03
Nickel
Copper
Nickel
Tin
CAS# or
Description
7440-21-3
7440-31-5
7439-92-1
9003-36-5
Trade Secret
25068-39-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
7440-31-5
7440-22-4
7440-50-8
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
% of
Component
100.00
63.00
37.00
Average Weight: 1.3890 g
Use in Product
Component Weight/
Substance Weight
(in grams)
Component %
of Total
Basis
Basis
Basis
0.156648
0.156648
0.007775
0.004898
0.002877
0.027300
11.278%
0.560%
1.965%
20.00
Basis
0.005460
15.00
5.00
Basis
Basis
0.004095
0.001365
5.00
51.50
1.00
2.50
96.50
3.00
0.50
70.60
6.70
20.10
0.80
1.80
66.00
2.67
23.33
2.33
5.67
Basis
Basis
Color Agent
Additives
Metal
Metal
Metal
Ceramic
Inner Electrode
Outer Electrode
Plating 1
Plating 2
Ceramic
Inner Electrode
Outer Electrode
Plating 1
Plating 2
0.001365
0.014060
0.000273
0.000683
0.002800
0.002702
0.000084
0.000014
0.014400
0.010166
0.000965
0.002894
0.000115
0.000259
0.000600
0.000396
0.000016
0.000140
0.000014
0.000034
0.202%
1.037%
0.043%
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK630 (v1.0) December 3, 2013
www.xilinx.com
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