PK610 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.2960 g

PK610 (v1.0) Sept 10, 2013
100% Material Declaration Data Sheet for 7
Series FGG484 Package
Average Weight: 2.2960 g
Component
Silicon Die
Die Attach Material
Mold Compound
Copper Wire
Solder Ball
Substrate
Substance
Description
Silicon
Silver
Bismaleimide
monomer
Acrylate monomer
Solid Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
Silica fused
Silicon Dioxide
Silica, crystalline
Copper
Palladium
Tin (Sn)
Silver (Ag)
Copper (Cu)
Gold (Au)
Nickel (Ni)
Copper Foil
Copper Plating
Continuous Filament
Fiber Glass
Non halogen fire
retardant
BT Core
Solder Mask
CAS Number
or
Description
% of
Component
Use in Product
7440-21-3
100.00
7440-22-4
Trade Secret
Trade Secret
77.50
15.00
7.50
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
7440-50-8
7440-05-3
98.25
1.75
7440-31-5
7440-22-4
7440-50-8
96.50
3.00
0.50
7440-57-5
7440-02-0
7440-50-8
7440-50-8
65997-17-3
Trade Secret
Trade Secret
Trade Secret
1.99
6.09
7.65
37.77
10.16
0.01
30.50
5.83
Component Weight/
Substance Weight
(in grams)
0.048674
0.048674
0.008859
0.006866
Component %
of Total
2.120%
0.386%
0.001329
0.000664
1.125465
0.056273
0.033764
0.033764
0.033764
0.003376
0.792327
0.168820
0.003376
0.006997
0.006875
0.000122
0.404317
0.390166
0.012130
0.002022
0.701689
0.013964
0.042733
0.053679
0.265028
0.071292
0.000070
0.214015
0.040908
49.019%
0.305%
17.610%
30.561%
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK610 (v1.0) Sept 10, 2013
www.xilinx.com
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