PK608 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 2.0928 g

PK608 (v1.0) May 17, 2013
100% Material Declaration Data Sheet for
Kintex^®-7 Device FB484 Package
Component
Silicon Die
Solder Bump
Underfill
Solder Paste
Solder Ball
Capacitor 1
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
Tin
Lead
7440-31-5
7439-92-1
Bisphenol F/
epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
9003-36-5
Trade Secret
25068-38-6
Trade Secret
60676-86-0
1333-86-4
Trade Secret
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Tin
Lead
BaTiO3 type
Ni
Cu
Ni
Sn
7440-31-5
7439-92-1
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
100.00
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
96.50
3.00
0.50
63.00
37.00
70.60
6.70
20.10
0.80
1.80
Average Weight: 2.0928 g
Use in Product
Component Weight/
Substance Weight
(grams)
0.182430
0.182430
0.008874
0.005591
0.003283
0.030000
Component
Percent of
Total
8.717
0.424
1.434
0.006000
Ceramic
Inner electrode
Out electrode
Plating1
Plating2
0.004500
0.001500
0.001500
0.015450
0.000300
0.000750
0.002804
0.002706
0.000084
0.000014
0.460670
0.290222
0.170448
0.010800
0.007625
0.000724
0.002171
0.000086
0.000194
0.134
22.013
0.516
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK608 (v1.0) May 17, 2013
www.xilinx.com
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