PK606 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 25.7005g

PK606 (v1.0) May 24, 2013
100% Material Declaration Data Sheet for
Virtex^®-7 Device FFG1926 Package
Average Weight: 25.7005g
Component
Silicon Die
Solder Bump
Solder Paste
Capacitor 1
Capacitor 2
Capacitor 3
Substance
Description
Silicon (Si)
Tin (Sn)
Lead (Pb)
Tin (Sn)
Silver (Ag)
Copper (Cu)
BaTiO3 type
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
BaTiO3 type
Nickel (Ni)
Indium tin oxide
Copper (Cu)
Nickel (Ni)
Tin (Sn)
BaTiO3 type
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
CAS Number
or
Description
Percentage
of
Component
Use in Product
7440-21-3
7440-31-5
7439-92-1
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
96.50
3.00
0.50
Basis
Basis
Basis
Basis
Basis
Basis
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
70.60
6.70
20.10
0.80
1.80
Ceramic
Inner electrode
Outer electrode
Plating 1
Plating 2
12047-27-7
7440-02-0
50926-11-9
7440-50-8
7440-02-0
7440-31-5
61.70
4.89
18.30
13.40
0.49
1.22
Ceramic
Inner Electrode
Outer Electrode
Outer Electrode
Plating1
Plating2
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
66.00
2.67
23.33
2.33
5.67
Ceramic
Inner Electrode
Outer Electrode
Plating1
Plating2
Component Weight/
Substance Weight
(grams)
0.893576
0.893576
0.043347
0.027309
0.016038
0.015400
0.014861
0.000462
0.000077
0.041280
0.029144
0.002766
0.008297
0.000330
0.000743
0.022800
0.014068
0.001115
0.004172
0.003055
0.000112
0.000278
0.009600
0.006336
0.000256
0.002240
0.000224
0.000544
Component
Percent of
Total
3.477
0.169
0.060
0.161
0.089
0.037
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other countries. All other trademarks are the property of their respective owners
PK606 (v1.0) May 24, 2013
www.xilinx.com
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