PK600 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.4728g

100% Material Declaration Data Sheet for
7 Series SBG484
PK600 (v1.0) February 15, 2013
Component
Silicon Die
Solder Bump
Underfill
Solder Ball
Substrate
Substance
Description
CAS Number
or
Description
Percentage
of
Component
Silicon (Si)
7440-21-3
100.00
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Bisphenol F/
epichlorohydrin
copolymer
Phenolic resin
Bisphenol A type liquid
epoxy resin
Amine type accelerator
Silicon dioxide
Carbon black
Additives
9003-36-5
trade secret
25068-38-6
trade secret
60676-86-0
1333-86-4
trade secret
63.00
37.00
20.00
15.00
5.00
5.00
51.50
1.00
2.50
Sn
7440-31-5
96.50
Ag
7440-22-4
3.00
Cu
7440-50-8
0.50
Copper (Cu)
Tin (Sn)
Lead (Pb)
Silver (Ag)
BT Core
ABF
Solder Mask
7440-50-8
7440-31-5
7439-92-1
7440-22-4
trade secret
trade secret
trade secret
36.72
1.38
0.41
0.02
47.75
11.22
2.51
Average Weight: 1.4728g
Use in Product
basis
basis
basis
Component Weight/
Substance Weight
(grams)
0.237468
0.237468
0.011261
0.007094
0.004167
0.035000
Component
Percent of
Total
16.123
0.765
2.376
basis
0.007000
basis
basis
basis
basis
basis
Additive
Main material
Main material
Main material
0.005250
0.001750
0.001750
0.018025
0.000350
0.000875
0.233980
0.225791
0.007019
0.001170
0.955101
0.350689
0.013140
0.003876
0.000203
0.456088
0.107127
0.023978
15.887
64.849
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK600 (v1.0) February 15, 2013
www.xilinx.com
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