PK592 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 2.9810 g

100% Material Declaration Data Sheet for
7 Series FGG676 Package
PK592 (v1.0) February 1, 2013
Component
Silicon Die
Die Attach
Mold
Compound
Copper Wire
Solder Ball
Substance
Description
CAS Number or Percentage of
Description
Component
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon black
Silica fused
Silica Dioxide
Silica, crystalline
Trade secret
Trade secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Copper
Palladium
7440-50-8
7440-05-3
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
100.00
77.50
15.00
7.50
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
98.20
1.80
96.50
3.00
0.50
Average Weight: 2.9810 g
Use in Product
Component Weight/
Substance Weight
(grams)
Component
Percent of
Total
0.048068
0.048068
0.008755
0.006785
0.001313
0.000657
1.497385
0.074869
0.044922
0.044922
0.044922
0.004492
1.054158
0.224608
0.004492
0.007404
0.007271
0.000133
0.564707
0.544942
0.016941
0.002824
1.612
0.294
50.231
0.248
18.944
© Copyright 2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK592 (v1.0) February 1, 2013
www.xilinx.com
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