PK588 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 13.6002g

PK588 (v1.0) January 25, 2013
100% Material Declaration Data Sheet for
7 Series FFG1158
Component
Silicon Die
Solder Bump
Solder Paste
Capacitor 1
Capacitor 2
Capacitor 3
Substance
Description
Silicon (Si)
Tin (Sn)
Lead (Pb)
Tin (Sn)
Silver (Ag)
Copper (Cu)
BaTiO3 type
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
BaTiO3 type
Nickel (Ni)
Indium tin oxide
Copper (Cu)
Nickel (Ni)
Tin (Sn)
BaTiO3 type
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
CAS Number
or
Description
Percentage
of
Component
7440-21-3
7440-31-5
7439-92-1
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
96.50
3.00
0.50
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
70.60
6.70
20.10
0.80
1.80
12047-27-7
7440-02-0
50926-11-9
7440-50-8
7440-02-0
7440-31-5
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
61.70
4.89
18.30
13.40
0.49
1.22
66.00
2.67
23.33
2.33
5.67
Average Weight: 13.6002g
Use in Product
Basis
Basis
Basis
Basis
Basis
Basis
Ceramic
Inner electrode
Outer electrode
Plating 1
Plating 2
Ceramic
Inner electrode
Outer electrode
Outer electrode
Plating 1
Plating 2
Ceramic
Inner electrode
Outer electrode
Plating 1
Plating 2
Component Weight/
Substance Weight
(grams)
0.828955
0.828955
0.038857
0.024480
0.014377
0.011300
0.010905
0.000339
0.000057
0.041280
0.029144
0.002766
0.008297
0.000330
0.000743
0.015200
0.009378
0.000743
0.002782
0.002037
0.000074
0.000185
0.003000
0.001980
0.000080
0.000700
0.000070
0.000170
Component
Percent of
Total
6.095
0.286
0.083
0.304
0.112
0.022
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other countries. All other trademarks are the property of their respective owners
PK588 (v1.0) January 25, 2013
www.xilinx.com
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