PK586 Datasheet, PDF (1/4 Pages) Xilinx, Inc – Average Weight: 14.3655g

PK586 (v1.1) August 22, 2014
100% Material Declaration Data Sheet for
7 Series FFG1156
Component
Silicon Die
Solder Bump
Solder Paste
Capacitor 1
Capacitor 2
Substance
Description
Silicon (Si)
Tin (Sn)
Lead (Pb)
Tin (Sn)
Silver (Ag)
Copper (Cu)
Barium oxide
Titanium dioxide
Misc.
Nickel (Ni)
Copper (Cu)
Silicon dioxide
Boric oxide
Nickel (Ni)
Tin (Sn)
Barium oxide
Titanium dioxide
Misc.
Nickel (Ni)
Copper (Cu)
Silicon dioxide
Boric oxide
Nickel (Ni)
Tin (Sn)
Average Weight: 14.3655g
CAS Number
or
Description
Percentage
of
Component
Use in Product
7440-21-3
7440-31-5
7439-92-1
7440-31-5
7440-22-4
7440-50-8
100.00
63.00
37.00
96.50
3.00
0.50
Basis
Basis
Basis
metal
metal
metal
1304-28-5
13463-67-7
trade secret
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
1304-28-5
13463-67-7
trade secret
7440-02-0
7440-50-8
7631-86-9
1303-86-2
7440-02-0
7440-31-5
37.46
18.73
6.24
17.95
15.88
1.41
0.35
0.54
1.44
40.00
20.00
6.67
2.42
20.73
1.85
0.45
2.12
5.76
Ceramic
Ceramic
Ceramic
Inner electrode
Outer electrode
Outer electrode
Outer electrode
Nickel Plating
Layer
Tin Plating Layer
Ceramic
Ceramic
Ceramic
Inner electrode
Outer electrode
Outer electrode
Outer electrode
Nickel Plating
Layer
Tin Plating Layer
Component Weight/
Substance Weight
(grams)
0.446519
0.446519
0.029370
0.018503
0.010867
0.005900
0.005694
0.000177
0.000030
0.037800
0.014160
0.007080
0.002359
0.006785
0.006003
0.000533
0.000132
Component
Percent of
Total
3.108%
0.204%
0.041%
0.263%
0.000204
0.000544
0.004800
0.001920
0.000960
0.000320
0.000116
0.000995
0.000089
0.000022
0.033%
0.000102
0.000276
© Copyright 2014 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK586 (v1.1) August 22, 2014
www.xilinx.com
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