PK554 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 20.7610 g

PK554 (v1.1) October 26, 2012
100% Material Declaration Data Sheet for
7 Series FFG1761
Average Weight: 20.7610 g
Component
Silicon Die
Solder Bump
Solder Paste
Capacitor 1
Capacitor 2
Capacitor 3
Substance
Description
CAS Number
or
Description
Percentage
of
Component
Silicon (Si)
7440-21-3
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
BaTiO3 type
Inner Electrode(Ni)
Outer Electrode(Cu)
Plating1(Ni)
Plating2(Sn)
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
BaTiO3 type
Inner Electrode(Ni)
Indium Tin Oxide
Outer Electrode(Cu)
Plating1(Ni)
Plating2(Sn)
12047-27-7
7440-02-0
50926-11-9
7440-50-8
7440-02-0
7440-31-5
BaTiO3 type
Inner Electrode(Ni)
Outer Electrode(Cu)
Plating1(Ni)
Plating2(Sn)
12047-27-7
7440-02-0
7440-50-8
7440-02-0
7440-31-5
100.00
63.00
37.00
96.50
3.00
0.50
61.80
27.00
9.90
0.40
0.90
61.70
4.89
18.30
13.40
0.49
1.22
66.00
2.67
23.33
2.33
5.67
Use in Product
Basis
Basis
Basis
Basis
Basis
Basis
Ceramic
Inner electrode
Outer Electrode
Plating1
Plating2
Ceramic
Inner electrode
Outer Electrode
Outer Electrode
Plating1
Plating2
Ceramic
Inner electrode
Outer Electrode
Plating1
Plating2
Component Weight/
Substance Weight
(grams)
0.828955
0.828955
0.038857
0.024480
0.014377
0.014700
0.014186
0.000441
0.000074
0.041280
0.025511
0.011146
0.004087
0.000165
0.000372
0.022800
0.014068
0.001115
0.004172
0.003055
0.000112
0.000278
0.005400
0.003564
0.000144
0.001260
0.000126
0.000306
Component
Percent of Total
(%)
3.993
0.187
0.071
0.199
0.110
0.026
© Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK554 (v1.1) October 26, 2012
www.xilinx.com
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