PK544 Datasheet, PDF (1/4 Pages) Xilinx, Inc – Average Weight: 14.3000g

PK544 (v1.0) March 7, 2012
100% Material Declaration Data Sheet for
EF1136 package
Average Weight: 14.3000g
Component
Silicon Die
Bump Die
Solder Paste
Capacitor 1
Capacitor 2
Coating 1
Substance
Description
Silicon (Si)
Tin (Sn)
Lead (Pb)
Tin (Sn)
Lead (Pb)
BaTiO3 type
Manganese Dioxide
Nickel (Ni)
Copper (Cu)
Boron Oxide
Nickel (Ni)
Tin (Sn)
Lead (Pb)
BaTiO3 type
Manganese Dioxide
Nickel (Ni)
Copper (Cu)
Boron Oxide
Nickel (Ni)
Tin (Sn)
Lead (Pb)
Silica
Epoxy Resin A
Epoxy Resin B
Hardener
CAS Number
or
Description
Percentage
of
Component
Use in Product
7440-21-3
7440-31-5
7439-92-1
7440-31-5
7439-92-1
100.00
63.00
37.00
63.00
37.00
Basis
Basis
Basis
Metal
Metal
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-31-5
7439-92-1
12047-27-7
1313-13-9
7440-02-0
7440-50-8
1303-86-2
7440-02-0
7440-31-5
7439-92-1
7631-86-9
9003-36-5
25068-38-6
19900-65-3
80.69
1.31
9.08
0.68
0.02
7.52
0.64
0.07
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
88.86
1.43
4.29
0.70
0.01
3.57
0.90
0.24
Ceramic
Ceramic
Internal Electrode
Termination
Termination
Plating
Plating
Plating
64.50
22.50
3.00
10.00
Basis
Basis
Basis
Basis
Component Weight/
Substance Weight
(grams)
0.422208
0.422208
0.015498
0.009764
0.005734
0.070000
0.044100
0.025900
0.027520
0.022207
0.000360
0.002498
0.000186
0.000004
0.002068
0.000177
0.000020
0.072000
0.063977
0.001029
0.003086
0.000504
0.000010
0.002571
0.000648
0.000175
0.013200
0.008514
0.002970
0.000396
0.001320
Component
Percent of
Total
2.953
0.108
0.490
0.192
0.503
0.092
© Copyright 2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK544 (v1.0) March 7, 2012
www.xilinx.com
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