PK504 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.292 g

100% Material Declaration Data Sheet for
Spartan®-3E/-3A FGG484 (Cu Wire) Package
PK504 (v1.1) March 19, 2012
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Copper Wire
Solder Balls
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Solid Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
Silica fused
Silicon Dioxide
Silica, crystalline
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Copper
Palladium
Impurities
7440-50-8
7440-05-3
NA
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
% of
Component
100.00
77.50
15.00
7.50
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
97.28
2.70
0.02
95.50
4.00
0.50
Average Weight: 2.292 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.043305
0.043305
0.007922
0.006140
Component %
of Total
1.889
0.346
0.001188
0.000594
0.811873
0.040594
0.024356
0.024356
0.024356
0.002436
0.571558
0.121781
0.002436
0.005455
0.005307
0.000147
0.000001
0.405411
0.387168
0.016216
0.002027
35.421
0.238
17.687
© Copyright 2011-2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK504 (v1.1) March 19, 2012
www.xilinx.com
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