PK492 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 3.9490 g

PK492 (v1.2) July 11, 2012
100% Material Declaration Data Sheet for
Spartan®-3 FGG900 (Cu Wire) Package
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Copper Wire
Solder Balls
Silicon
7440-21-3
Silver (Ag)
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Solid Epoxy Resin
Phenol Resin
Phenol Novolac
Metal Hydroxide
Carbon Black
Silica fused
Silica Dioxide
Silica, crystalline
Trade Secret
Trade Secret
9003-35-4
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Copper (Cu)
Palladium
Impurities
7440-50-8
7440-05-3
NA
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
% of
Component
100.00
77.50
15.00
7.50
5.00
3.00
3.00
3.00
0.30
70.40
15.00
0.30
97.28
2.70
0.02
95.50
4.00
0.50
Average Weight: 3.9490 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.107655
0.107655
0.018830
0.014593
Component %
of Total
2.726
0.477
0.002825
0.001412
1.862156
0.093108
0.055865
0.055865
0.055865
0.005586
1.310958
0.279323
0.005586
0.009371
0.009116
0.000253
0.000002
0.753863
0.719939
0.030155
0.003769
47.155
0.237
19.090
© Copyright 2011-2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK492 (v1.2) July 11, 2012
www.xilinx.com
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