PK480 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.545 g

100% Material Declaration Data Sheet CS324
PK480 (v1.0) June 17, 2011
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Gold Wire
Mold
Compound
Solder Balls
Substrate
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Gold
Palladium
7440-57-5
7440-05-3
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Copper (Cu)
Nickel (Ni)
Gold (Au)
Glass fiber
Non-Halogen Fire
retardant
BT (core)
Solder mask
7440-50-8
7440-02-0
7440-57-5
65997-17-3
NA
NA
NA
Average Weight: 0.545 g
% of
Component
Use in Product
100.00
Main material
77.50
Main material
Component Weight/
Substance Weight
(in grams)
0.009997
0.009997
0.007051
0.005465
Component %
of Total
1.834
1.294
15.00
Main material
0.001058
7.50
Main material
99.05
0.95
Main material
Dopant
5.00
5.00
84.45
5.00
0.55
Main material
Main material
Filler
Flame retardant
Color agent
63.00
37.00
Main material
Main material
13.309
4.696
5.606
19.884
0.082
43.154
13.269
Main material
Main material
Main material
Glass fiber
Flame retardant
Core
Solder mask
0.000529
0.006702
0.006638
0.000064
0.216990
0.010850
0.010850
0.183248
0.010850
0.001193
0.096708
0.060926
0.035782
0.207552
0.027623
0.009747
0.011635
0.041270
0.000170
0.089567
0.027540
1.230
39.815
17.745
38.083
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK480 (v1.0) June 17, 2011
www.xilinx.com
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