PK469 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 3.949 g

PK469 (v1.0) Jul 29, 2011
100% Material Declaration Data Sheet FGG900
Spartan-6
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Gold Wire
Solder Balls
Substrate
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
Gold
Palladium
7440-57-5
7440-05-3
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
Copper
Nickel
Gold
BT (core)
Solder mask
7440-50-8
7440-02-0
7440-57-5
21645-51-2
7440-50-8
Epoxy resin
14807-96-6
7727-43-7
7631-86-9
34590-94-8
85954-11-6
Average Weight: 3.949 g
% of
Component
Use in Product
100.00
77.50
15.00
Main material
Main material
Main material
Component Weight/
Substance Weight
(in grams)
0.090946
0.090946
0.016016
0.012412
0.002402
Component %
of Total
2.303
0.406
7.50
5.00
5.00
87.45
2.00
0.55
99.05
0.95
96.50
3.00
0.50
28.19
4.13
0.30
59.49
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
Main material
0.001201
1.876994
0.093850
0.093850
1.641431
0.037540
0.010323
0.023056
0.022837
0.000219
0.751829
0.725515
0.022555
0.003759
1.190159
0.335483
0.049192
0.003529
0.708012
47.531
0.584
19.038
30.138
7.89
Main material
0.093943
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK469 (v1.0) July 29, 2011
www.xilinx.com
1