PK461 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 1.2956 g

PK461 (v1.0) March 4, 2011
100% Material Declaration Data Sheet TQG144
Spartan-3AN
Component
Substance
Description
CAS# or
Description
Silicon Die
(FPGA)
Silicon Die
(PROM)
Mold
Compound
Die Attach
Adhesive
Silicon
Silicon
Silica Fused
Epoxy Resin
Phenol Resin
Carbon Black
Silver
7440-21-3
7440-21-3
60676-86-0
Trade Secret
Trade Secret
1333-86-4
7440-22-4
Die Attach
Film
Solder Plating
Gold Wire
Epoxy Resin
t-Butyl phenyl
glycidyl ether
Phenolic resin
Butyl cellosolve
acetate
Dicyandiamide
Solid Epoxy Resin
Phenol Resin
Fused Silica
Synthetic Rubber
Tin (Sn)
Gold
9003-36-5
3101-60-8
92-88-6
112-07-2
461-58-5
Trade Secret
Trade Secret
60676-86-0
Trade Secret
7440-31-5
7440-57-5
% of
Component
100.00
100.00
87.70
7.00
5.00
0.30
69.50
20.00
7.50
Average Weight: 1.2956 g
Use in Product
Silicon IC
Silicon IC
Filler
Polymer
Hardener
Colouring
Die to package
adhesive
Conductive
material
Polymer
Diluent
Component Weight/
Substance Weight
(in grams)
0.007150
0.007150
0.002283
0.002283
1.006400
0.882613
0.070448
0.050320
0.003019
0.002234
0.001553
0.000447
0.000168
Component %
of Total
0.552
0.176
77.676
0.172
1.00
Hardener
1.00
Solvent
0.000022
0.000022
1.00
12.50
12.50
35.00
40.00
100.00
100.00
Polymer
Die to die
adhesive
Polymer
Hardener
Filler
Filler
Base metal
Metallurgy
0.000022
0.000713
0.000089
0.000089
0.000250
0.000285
0.013400
0.013400
0.003362
0.003362
0.055
1.034
0.259
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK461 (v1.0) March 4, 2011
www.xilinx.com
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