PK456 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 5.6250 g

PK456 (v1.0) January 28,
2011
100% Material Declaration Data Sheet FG1156
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Gold Wire
Solder Balls
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Epoxy Resin A
Epoxy Resin B
Phenol Resin A
Phenol Resin B
Metal Hydroxide
Carbon Black
Silica Fused
Silica Fused
Silica, crystalline
Trade Secret
Trade Secret
Trade Secret
Trade Secret
Trade Secret
1333-86-4
60676-86-0
7631-86-9
14808-60-7
Gold
Palladium
Calcium
7440-57-5
7440-05-3
7440-70-2
Tin
Lead
7440-31-5
7439-92-1
% of
Component
100.00
77.50
15.00
Average Weight: 5.6250 g
Use in Product
Component Weight/
Substance Weight
(in grams)
0.256153
0.256153
0.072582
0.056251
0.010887
Component %
of Total
4.554%
1.290%
7.50
3.00
3.00
3.00
3.00
1.50
0.30
70.90
15.00
0.30
99.05
0.95
0.00
63.00
37.00
0.005444
2.292107
0.068763
0.068763
0.068763
0.068763
0.034382
0.006876
1.625104
0.343816
0.006876
0.029878
0.029594
0.000284
0.000001
1.100277
0.693175
0.407102
40.749%
0.531%
19.560%
© Copyright 2011 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included h0.erein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners
PK456 (v1.0) January 28, 2011
www.xilinx.com
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