PK427 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 20.8072 g

100% Material Declaration Data Sheet for
FFG1759 Virtex®-6
PK427 (v1.2) October 19, 2012
Component
Silicon Die
Solder Bump
Die Underfill
Substrate
Substance
Description
Doped silicon
Tin
Lead
Bisphenol F-type
liquid epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
Copper
Tin
Lead
Silver
BT Core
ABF
Soldermask
CAS Number
or
Description
Percentage
of
Component
7440-21-3
7440-31-5
7439-92-1
100.00
63.00
37.00
9003-36-5
Trade secret
25068-38-6
20.00
15.00
5.00
Average Weight: 20.8072 g
Use in Product
Silicon IC
Basis
Die to package
Basis
Basis
Component Weight/
Substance Weight
(grams)
0.935666
0.935666
0.048899
0.030806
0.018093
0.130000
Component
Percent of Total
4.497
0.235
0.625
Basis
0.026000
Basis
0.019500
Basis
0.006500
Trade secret
60676-86-0
1333-86-4
Trade secret
5.00
51.50
1.00
2.50
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
35.78
0.89
0.19
0.02
42.35
19.64
1.13
Basis
Basis
Basis
Basis
Main material
Main material
Main material
Main material
Main material
Main material
Main material
0.006500
0.066950
0.001300
0.003250
5.886081
2.106128
0.052415
0.011172
0.001084
2.492625
1.156000
0.066657
28.289
© Copyright 2010-2012 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States
and other countries. All other trademarks are the property of their respective owners
PK427 (v1.2) October 19, 2012
www.xilinx.com
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