PK423 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 0.7170g

PK423 (v1.0) September 30, 2010
100% Material Declaration Data Sheet
FTG256 Package for Spartan-6 FPGAs
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold Compound
Substrate
Core
Solder Mask
Gold Wire
Silicon
Silver
Bismaleimide
Monomer
Acrylate Monomer
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Copper
Nickel
Gold
Epoxy Resin
Inorganic Filler
Fiberglass
Copper
Talc
Morpholine
Derivative
Barium Sulfate
Silica
Dipropylene Glycol
Monomethyl Ether
Epoxy Resin
Gold
Palladium
Calcium
CAS Number
or
Description
7440-21-3
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
7440-50-8
7440-02-0
7440-57-5
Trade Secret
21645-51-2
65997-17-3
7440-50-8
14807-96-6
Trade Secret
7727-43-7
7631-86-9
34590-94-8
85954-11-6
7440-57-5
7440-05-3
7440-70-2
Percentage of
Component
100.00
77.50
15.00
7.50
5.00
5.00
87.45
2.00
0.55
14.12
6.23
1.24
24.33
9.12
24.32
3.04
0.88
0.53
7.74
0.18
4.58
3.70
99.05
0.95
0.00
Average Weight: 0.7170g
Use in
Product
Component
Weight/
Substance Weight
(grams)
0.01192
0.01192
0.002453
0.001901
Component
Percent of Total
1.663
0.342
0.000368
0.000184
0.384597
0.019230
0.019230
0.336330
0.007692
0.002115
0.184309
0.026027
0.011479
0.002284
0.044844
0.016809
0.044825
0.005603
0.001622
53.640
25.706
0.000973
0.014272
0.000324
0.008434
0.006812
0.009626
0.009534
0.000091
0.000000
1.343
© 2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries.
All other trademarks are the property of their respective owners.
PK423 (v1.0) September 30, 2010
www.xilinx.com
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