PK422 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 2.981g

PK422 (v1.0) September 28, 2010
100% Material Declaration Data Sheet
FGG676 Package for Spartan-6 FPGAs
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold Compound
Gold Wire
Solder Balls
Substrate
Silicon
Silver
Bismaleimide
Monomer
Acrylate Monomer
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Gold
Palladium
Calcium
Tin
Silver
Copper
Copper
Nickel
Gold
Fiberglass
Non-Halogen FR
BT (Core)
Solder Mask
CAS Number
or
Description
7440-21-3
7440-22-4
Trade Secret
Trade Secret
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
7440-57-5
7440-05-3
7440-70-2
7440-31-5
7440-22-4
7440-50-8
7440-50-8
7440-02-0
7440-57-5
65997-17-3
NA
NA
NA
Percentage of
Component
100.00
77.50
15.00
7.50
11.00
11.00
62.40
15.05
0.55
99.05
0.95
0.00
96.50
3.00
0.50
33.29
4.84
0.35
17.24
0.01
36.13
8.14
Use in
Product
Average Weight: 2.981g
Component
Weight/
Substance Weight
(grams)
0.090946
0.090946
0.016016
0.012412
Component
Percent of Total
3.051
0.537
0.002402
0.001201
1.371554
0.150871
0.150871
0.855850
0.206419
0.007544
0.015517
0.015369
0.000147
0.000000
0.564707
0.544942
0.016941
0.002824
0.922260
0.307002
0.044637
0.003228
0.158998
0.000111
0.333213
0.075072
46.010
0.521
18.944
30.938
© 2010 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries.
All other trademarks are the property of their respective owners.
PK422 (v1.0) September 28, 2010
www.xilinx.com
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