PK407 Datasheet, PDF (1/3 Pages) –

PK407 (v1.1) April 9, 2012
100% Material Declaration Data Sheet CSG225
for Spartan®-6 FPGAs
Average Weight: 0.3830 g
Component
Substance
Description
CAS# or
Description
Silicon Die
Die Attach
Material
Mold
Compound
Gold Wire
Solder Balls
Silicon
7440-21-3
Silver
Bismaleimide
monomer
Acrylate monomer
7440-22-4
Trade Secret
Trade Secret
Solid Epoxy Resin
Phenol Resin
Fused Silica
Metal Hydroxide
Carbon Black
Trade Secret
Trade Secret
60676-86-0
Trade Secret
1333-86-4
Gold
Palladium
Calcium
7440-57-5
7440-05-3
7440-70-2
Tin
Silver
Copper
7440-31-5
7440-22-4
7440-50-8
% of
Component
100.00
77.50
15.00
7.50
11.00
11.00
62.40
15.05
0.55
99.05
0.95
0.00
96.50
3.00
0.50
Use in Product
Component Weight/
Substance Weight
(in grams)
0.012563
0.012563
0.002453
0.001901
0.000368
0.000184
0.169140
0.018605
0.018605
0.105543
0.025456
0.000930
0.002453
0.002430
0.000023
0.000000
0.063453
0.061232
0.001904
0.000317
Component %
of Total
3.280
0.640
44.162
0.640
16.567
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PK407 (v1.1) April 9, 2012
www.xilinx.com
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