PK402 Datasheet, PDF (1/3 Pages) Xilinx, Inc – Average Weight: 4.1856g

PK402 (v1.2) September 28,
2012
100% Material Declaration Data Sheet FF484
Component
Silicon Die
(FPGA)
Solder Bump
Die Underfill
Substrate
Solder Paste
Substance
Description
Doped silicon
Tin
Lead
Bisphenol F-type
liquid epoxy resin
Phenolic resin
Bisphenol A-type
liquid epoxy resin
Amine type
accelerator
Silicon dioxide
Carbon black
Additives
Copper
Tin
Lead
Silver
BT Core
ABF
Soldermask
Tin
Silver
Copper
CAS Number
or
Description
Percentage
of
Component
7440-21-3
7440-31-5
7439-92-1
9003-36-5
100.00
63.00
37.00
20.00
Average Weight: 4.1856g
Use in Product
Silicon IC
Die to package
Basis
Component Weight/
Substance Weight
(grams)
0.340000
0.340000
0.173000
0.108990
0.064010
0.130000
0.026000
Component
Percent of Total
8.123
4.133
3.106
Trade secret
25068-38-6
15.00
2.50
Basis
Basis
0.019500
0.003250
Trade secret
2.50
Basis
0.003250
60676-86-0
1333-86-4
Trade secret
7440-50-8
7440-31-5
7439-92-1
7440-22-4
N/A
N/A
N/A
7440-31-5
7440-22-4
7440-50-8
57.00
0.50
2.50
24.96
1.62
0.54
0.02
32.94
38.57
1.34
96.50
3.00
0.50
Basis
Basis
Basis
Main Material
Main Material
Main Material
Main Material
Main Material
Main Material
Main Material
Basis
Basis
Basis
0.074100
0.000650
0.003250
1.316698
0.328651
0.021349
0.007158
0.000309
0.433780
0.507840
0.017611
0.010500
0.010133
0.000315
0.000053
31.458
0.251
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PK402 (v1.2) September 28, 2012
www.xilinx.com
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