PK399 Datasheet, PDF (1/2 Pages) Xilinx, Inc – Average Weight: 3.9000g

PK399 (v1.0) December 7, 2009
Component
Substance
Description
Silicon Die
Die Attach
Material
Mold Compound
Substrate
Gold Wire
Solder Balls
Silicon
Polymetric material
Di-Ester resin
Functionalized
ester
Silver
Solid epoxy resin
Phenol resin
Fused silica
Metal hydro oxide
Carbon black
Crystalline silica
Copper
Nickel
Gold
Glass fiber (GF)
Flame retardant
BT (core)
HL-832NX
Solder mask (EP)
Gold
Palladium
Beryllium
Calcium
Tin
Lead
100% Material Declaration Data Sheet BG575
CAS Number
or
Description
Percentage of
Component
7440-21-3
Proprietary
Proprietary
Proprietary
7440-22-4
Trade secret
Trade secret
60676-86-0
Trade secret
1333-86-4
14808-60-7
7440-50-8
7440-02-0
7440-57-5
N/A
N/A
N/A
N/A
7440-57-5
7440-05-3
7440-41-7
7440-70-2
7440-31-5
2425-79-8
100.00
3.00
7.50
3.00
86.50
5.00
5.00
83.00
1.00
1.00
5.00
46.27
0.60
0.13
23.00
3.20
16.80
10.00
99.05
0.95
0.00
0.00
63.00
37.00
Average Weight: 3.9000g
Use in
Product
Component
Weight/
Substance Weight
(Grams)
0.08304
0.08304
0.012939
0.000388
0.000970
0.000388
Component
Percent of Total
2.129%
0.332%
Metal layer
Metal layer
Metal layer
0.011192
1.79122
0.089561
0.089561
1.486711
0.017912
0.017912
0.89561
0.883503
0.408797
0.005301
0.001149
0.203206
0.028272
0.148429
45.929%
22.654%
Trace
Trace
0.088350
0.019700
0.019512
0.000187
0.0000003
0.0000004
1.109600
0.699048
0.410552
0.505%
28.451%
© 2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries.
All other trademarks are the property of their respective owners.
PK399 (v1.0) December 7, 2009
www.xilinx.com
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